JESD22-A104 Temperature Cycling Chamber

Name: JESD22-A104 Temperature Cycling Chamber
Brand: Xi'an LIB Environmental Simulation Industry

JESD22-A104 Temperature Cycling Chamber for Semiconductor Reliability Testing

LIB Industry JESD22-A104 temperature cycling chambers are designed for semiconductor devices, electronic components, PCB assemblies, and automotive electronics reliability testing. The thermal cycling chambers simulate repeated thermal stress to reveal solder joint fatigue, package cracking, delamination, and other failure modes before products enter the market.

✔ 100% compliant with JESD22-A104 Conditions A–M
✔ Temperature ramp rates up to 10°C/min–15°C/min
✔ Temperature fluctuation ≤ ±0.5°C
✔ Temperature uniformity ≤ ±2.0°C
✔ Temperature range from -70°C to +150°C

Supporting JESD22-A104, AEC-Q100, and IEC 60068-2-14 testing requirements, LIB chambers provide accurate, repeatable thermal cycling for semiconductor qualification and reliability validation.

Standard Models: TR5-100, TR5-225, TR5-500, TR5-800, TR5-1000 and more customized models

JESD22-A104 Test Conditions Fully Supported

LIB Industry temperature cycling chambers are designed to fully support the temperature profiles specified in JESD22-A104, allowing users to switch easily between different test conditions according to product requirements.It supports for JESD22-A104 Conditions A–M.

Condition	Low Temperature	High Temperature	Typical Applications
A	-55°C (+0/-10°C)	+85°C (+10/-0°C)	Consumer electronics, commercial-grade ICs
B	-55°C (+0/-10°C)	+125°C (+10/-0°C)	Industrial components, general automotive electronics
C	-65°C (+0/-10°C)	+150°C (+10/-0°C)	Aerospace, military, high-reliability semiconductor devices
G	-40°C (+0/-10°C)	+125°C (+10/-0°C)	Automotive electronics (AEC-Q100 / AEC-Q200)
H	-55°C (+0/-10°C)	+175°C (+10/-0°C)	High-temperature power semiconductors and advanced electronic devices

The temperature cycling chamber supports programmable temperature cycling profiles with customizable ramp rates, dwell times, and cycle counts. Test parameters can be configured to meet JESD22-A104 requirements based on specimen mass, thermal load, and qualification objectives.

Why Choose LIB Industry for JESD22-A104 Testing?

Wide Temperature Range

Available temperature ranges:

-20°C to +150°C
-40°C to +150°C
-70°C to +150°C Suitable for all JESD22-A104 test conditions.

Precise Temperature Control

Temperature fluctuation: ±0.5°C
Temperature deviation: ±2.0°C
Uniform airflow distribution Ensures every sample experiences the same thermal stress throughout long-duration testing.

Reliable Continuous Operation

Semiconductor qualification programs often require testing for several weeks.

LIB chambers feature:

SUS304 stainless steel workspace
Industrial refrigeration system
Long-life circulation fan
Continuous operation capability Designed for extended reliability testing without interruption.

Programmable Thermal Profiles

The touchscreen controller allows users to create customized thermal cycling profiles including:

Ramp rate control
Dwell time control
Cycle counting
Automatic operation
Data recording

Specifications of JESD22-A104 Temperature Cycling Chamber

Model	TR5-100	TR5-225	TR5-500	TR5-800	TR5-1000
Internal Dimension (mm)	400500500	500600750	700800900	80010001000	100010001000
Overall Dimension (mm)	90010501620	100011401870	120013402020	130015402120	150015402140
Interior Volume	100L	225L	500L	800L	1000L
Heat load	1000W
Temperature Range	A : -20℃ ~ +150 ℃ B : -40℃ ~ +150 ℃ C: -70℃ ~ +150 ℃
Temperature Fluctuation	± 0.5 ℃
Temperature Deviation	± 2.0 ℃
Cooling Rate	10℃/min (15℃/min)
Heating Rate	10℃/min (15℃/min)
Controller	Programmable color LCD touch screen controller, Multi-language interface, Ethernet , USB
Cooling System	Mechanical compression refrigeration system
Exterior Material	Steel Plate with protective coating
Interior Material	SUS304 stainless steel
Power Supply	380V
Maximum Noise	65 dBA

JESD22-A104 Temperature Cycling Applications

JESD22-A104 temperature cycling testing is widely used across semiconductor, automotive, and electronics industries to evaluate product reliability under repeated thermal stress.