Rapid Temperature Change Chamber for High-Reliability Electronic Testing
The Environmental Stress Screening (ESS) Test Chamber from LIB industry is designed to quickly identify hidden manufacturing defects in electronic components, assemblies, and high-reliability systems by applying rapid thermal stress conditions far beyond conventional environmental testing.
By simulating extreme temperature transitions from -70°C / -40°C / -20°C up to +150°C, and achieving rapid temperature change rates up to 5–20°C/min, this ESS chamber accelerates failure detection and significantly improves product reliability before field deployment.
Unlike traditional temp and humidity chambers with slow transition rates (1–3°C/min), ESS testing forces components through intense thermal expansion and contraction cycles, revealing latent defects such as solder joint defects, material fatigue, and connector failures.
Standard Models : TR5-100, TR5-225, ..., TR5-1000 and more customized models.
Applicable Standards: AAMA501, ASTM D4169-16, IEC 61215, IEC 61646, IEC61108, IEC62688, MIL-STD-810D
English
русский
français
العربية
Deutsch
Español
한국어
italiano
tiếng việt
ไทย
Indonesia





